Project Information per year
2012 - 2011 - 2010 - 2009 -2008 - 2007 - 2006 - 2005 - 2004
PROJECT I.2
LITHOGRAPHY and Plasma processes for ELECTRONICS, MICROFLUIDCS, and SURFACE Nano-ENGINEERING
Project leaders: E. Gogolides, A. Tserepi
Other key researchers: K. Misiakos, N. Glezos
Post-doctorals: G. Patsis, Ε. Tegou, V. Constantoudis
PhD candidates: G. Kokkoris, P. Bayiati, N. Vourdas
MSc Students: V. Sarris
External collaborators: A. Boudouvis (NTUA), P. Leunissen (IMEC), Th. Christopoulos (U. Patras),
Y. Wang, J. Roberts (INTEL)
Projects Running:
- EU, 157 CRISPIES, Contract No: 30143
- EU, SOARING, Contract No: 35254
- INTEL-MoleEUV
- Nano2life EU Network of Excellence
- PHOTRONICS
Objectives:
During 2004 our nanopatterning activity focused in the metrology, characterization and simulation of Line Edge or Line Width Roughness (LER, LWR) for sub-100nm CMOS lithography and Etching. Our LWR metrology software is now friendly and robust, and it is thus used by other laboratories such as IMEC and INTEL. Our stochastic Lithography Simulator is also now a fast tool for investigation of process and material effects on LWR. In addition plasma etching of ultra thin photoresist films has proven that the etching rate drops as the photoresist thickness is reduced, thus alleviating some etch resistance demands of ultra thin films.
A significant advancement was also the completion of an integrated topography simulator for microelectronics and Microsystems fabrication. This work opens new possibilities in the simulation of plasma processes and process design and optimization.
During 2004 the group has also focused its activity in the fabrication of polymer-based microfluidics for biomicrosystems (Programme III. 2 led by Dr K. Misiakos). Polydimethylsiloxane as well as PolyMethylMethAcrylate were patterned both with soft lithography and classical lithography followed by plasma etching. We expect that this growing activity will soon become a program on its own.
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