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Project Information per year
2012 - 2011 - 2010 - 2009 - 2008 - 2007 - 2006 - 2005 - 2004
PROJECT I.2
LITHOGRAPHY and Plasma processes for ELECTRONICS, MICROFLUIDCS, and SURFACE Nano-ENGINEERING
Key researchers: E. Gogolides, A. Tserepi
Collaborating researchers: K. Misiakos, I. Raptis, P. Argitis, C.Tsamis, S. Chatzandroulis
Permanent Researcher: V. Constantoudis
Researchers on Contract: G.P. Patsis, G. Kokkoris, N. Vourdas
PhD candidates: P. Bayiati, M. Vlachopoulou, G. Boulousis, K. Tsougeni, A. Malainou,
D. Kontziampasis
MSc Students: K. Kontakis, D. Papageorgiou, K. Ellinas, H. Christoyianni
Engineer: K. Kontakis
External collaborators: A. Boudouvis and M. Kalantzopooulou (NTUA, Greece), N. Hadjichristidis and E. Iatrou (UoA, Greece), S.Garbis and A. Vlahou (IIBEAA, Greece),
S. Kakabakos and P. Petrou (IRRP, NCSR-Demokritos, Greece), G. Kaltsas (TEI Athens Greece), K. Beltsios (U. Ioannina, Greece), E. Gizeli and K. Mitsakakis (Univ. of Crete-FORTH, Greece) C. Cardinaud (U. Nantes, France), I. Rangelow and B. Volland (Univ. Ilmenau Germany), M. Cooke and A. Goodyear (Oxford Instruments Plasma Technology, UK), S. Daniels (DCU, Ireland), A. Erdmann (Fraunhofer, Germany), S. Tedesco, E. Pargon (CEA-LETI, France)
- IEU NMP NoE Nano2Life, Contract No 500057, 1/2/2004-31/1/2008
- EU NMP2 STREP Nanoplasma, Contract No 016424 , 1/4/2006-31/3/2009
- GSRT, PENED 03 ED 202, 1/12/2005-30/06/2009
- DHMOEREUNA-2005, 1/1/2007-30/9/2008
- MD3, IT 214948, 1/12/2007-30/11/2009
Objectives:
Lithography and plasma etching are used as enabling technologies not only for electronics and MEMs, but also for microfluidics and lab-on-a-chip fabrication and modification. We are developing deterministic and stochastic microfabrication processes for a broad range of applications including life sciences using top-down fabrication and plasma directed assembly. Process simulation is a key activity to understand and predict the phenomena explored experimentally:
- For nano-electronics our work focuses on Line Edge Roughness (LER) prediction using molecular simulation, LER noise-free measurement from SEM images, and LER transfer during plasma etching (see section A).
- For microfluidics we use Deep Plasma Etching, and plasma assisted bonding to fabricate PDMS, PMMA, PEEK and Si microfluidic devices, such as chromatography columns. We also demonstrate novel plasma-based micro array fabrication process (see section B).
- We have developed promising nano manufacturing processes for stochastic nano-texturing of polymers, and found that protein adsorption is greatly enhanced on such smart surfaces. In addition we have discovered that plasma directed assembly of periodic nanodots can take place during etching of polymers, thus paving the way to plasma based lithography-less nanofabrication. Finally we propose a fast in-situ method to measure surface roughness during etching using spectroscopic ellipsometry (see section C).
- In order to understand the phenomena induced from plasma processing we are also developing the components of a total multi scale plasma simulator, comprising gas phase kinetics, surface kinetics, microstructure etching, and nanoscale etching simulation. Gas phase kinetics of common gases (C4F8 and SF6) and profile simulation are modeled, as well as nanotexturing of porous films during etching (see section D).
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Research
